Study on reliability of metal fuse for sub-100nm technology

Tungsten bit line fuse has been used for years in repair application but it fails during BOC (board on chip) package PCT (pressure cooker test) because of its weakness to corrosion. We searched for new material against corrosion, and metal-1 aluminum fuse was set up. Although there is no failure in PCT, we have found a fatal failure in IMD (inter-metal dielectric) crack during THB (temperature humidity bias test). We developed SiN full passivation scheme to resolve the failure then there is no failure until THB 1000 hours. Finally we set up metal-1 aluminum fuse process for sub-100 nm technology