Packaging of silicon pressure sensors for home appliances

In this paper a packaging technology proposal for piezoresistive pressure sensors is presented which is mainly characterized by its low cost. Assembly of the pressure device is made by direct adhesion of the silicon die on standard PCB and protection against aggressive media is obtained by using thermally cured silicone gel. Characterization of the packaged sensors has shown that when using a suitable signal-conditioning circuitry the sensor microsystem performance is adequate for its use in home appliances.