A 3D integration scheme utilizing wireless interconnections for implementing hyper brains

A 3D integration custom stack system utilizing a local wireless interconnect (LWI) and a global wireless interconnect (GWI) is proposed. The LWI transfers Gb/s pulses using resonant coupling of spiral inductors with low-power dissipation of several mW. The GWI transfers global clocks and data on a 20 GHz signal using on-chip antennas.