Built-in via module test structure for backend interconnection in-line process monitor

The best in-line process monitoring test structure should have multiple purposes, one of which is to allow easy assessing and quick defect identification. In this study, the via module test structure has been designed allowing easy assessment of the via profiles of via, coupled with the resistance measurement of the via, such can be used as effect via module defect monitor. This structure can be used as frame monitor structure. Via module test structure is realized in Cu/low K (Black Diamond /spl trade/) interconnection.