In-situ resist temperature monitor during hot embossing lithography by fluorescence probe technique

It is well known that temperature variation will influence the polymer (resist) deformation especially around the transition temperature of polymer in hot embossing lithography. In addition, resist heating is also one of the major contributing factors to the critical dimension error budget.' Conventionally, the temperature measurement method usually based on thermocouple2 or IR thermal detector, it can not easily in-situ measure the temperature of resist film as thin as sub-micrometer. To measure the resist film temperature during the processes, we develop a fluorescence probe method to record the highest temperature in resist deformation processes.