Experimental evaluation of arrayed microcolumn with a monolithic structure

Lithography with low energy multiple electron beam approach is one of the most promising high-throughput solution for fabrication of devices with sub-50 nm resolution. 1-2 In multiple beam approach, throughput is proportional to the total number of beam current exposed to wafer.3 The multi-beam approach can be categorized by three ways: array of Single Column Modules (SCM), Monolithic Column Module (MCM), and Wafer-Scale Column Module (WCM).4 MCM or WCM approaches offer a higher packing density with improved performance and reliability. Monolithic or wafer-scale microcolumn components should be studied separately for fully-working MCM or WCM structure.