InP HBT IC manufacturing

An InP HBT IC process technology has been developed to manufacture high performance electronics for commercial and military applications. Mainstream semiconductor production practices, statistical process control (SPC) and process failure mode effects and analysis (PFMEA) have been implemented to sustain run-to-run consistency and uniformity of the processed wafers. Process reliability qualification of fabricated devices has yielded a projected mean-time-to-failure (MTTF) of 5e6 hours at the operating condition of T/sub j/=125 /spl deg/C and J/sub c/=100 kA/cm/sup 2/. Comprehensive design kits consisting of VBIC device models, design layout rules, and standard library cells are provided to maximize first-pass success and enable ease of design with this new device technology. Published state-of-the-art circuits performance using this process technology clearly demonstrate its viability for mainstream applications.