Improving bonding quality in MEMS using silicon/gold/glass bonding by laser

A Nd:YAG laser method for fusion bonding between silicon and glass at low temperature has been successfully demonstrated. This method could overcome the damage to movable mechanical parts caused by the electrostatic forces in a MEMS (micro-electronic-machine-system) device during anodic bonding. In addition, it could successfully bond silicon wafer and glass at low temperature, as the Au/Si alloy fusion temperature is 365/spl deg/C.