Fabrication and integration of high performance mixed signal and RF passive components in 0.13/spl mu/m Cu BEOL technologies

High-performance passive components are keys to reach system-on-a-chip (SOC) solution of mixed-signal and radio frequency (RF) circuit design. This paper presents the fabrication and integration of high performance mixed-signal and RF passive components using industrial standard 0.13/spl mu/m Cu BEOL technologies. On-chip inductor with 6/spl mu/m ultra-thick top metal is reported firstly. A 1.85-nH inductor achieved a peak quality factor (Q) of 27. Followed by high-performance/low-cost 1.5fF//spl mu/m/sup 2/ metal-insulator-metal (MTM) capacitors which increases capacitance density by 50% comparing to current industrial standard. Finally, high resistivity poly (HRP) resistors are shown. Deep n-well (DNW) is also part of the process in this study.