An integrated folded-patch antenna for wireless microsystems

A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.