3D ultrasound imaging system using Fresnel ring array & high voltage multiplexer IC

In a previous report (Satoshi Tamano et al, Proc. IEEE Ultrason. Symp., p.1310-1313, 2003), a prototype 2D convex-convex shaped array probe and a real-time 3D ultrasound imaging prototype system was reported. This time, our convex-convex (40 mmR-40 mmR, 3.5 MHz center frequency) shaped 2D array probe is modified to include approximately 8,000 PZTs. Moreover, the scale of our custom multiplexer IC is enlarged from 8:1 with 8 channels to 32:1 with 32 channels. These high voltage multiplexer ICs are chip-on-board (COB) mounted on a PCB inside the 2D array probe. With this improved probe and multiplexer ICs, it is possible to bundle more than 3,000 active PZTs into 32 Fresnel rings. It is expected that our system will enable us to form a uniform beam in a 3D space by use of the Fresnel ring and to bundle a large number of PZTs into 32 to 64 channels.