Use of LPCVD TEOS as a direct bonding material for layer transfer: densified vs. undensified

In this work, LPCVD deposited TEOS, both densified (DT)/undensified (UDT) and structured/non-structured cases are systematically studied and optimized. We have investigated different oxide type bonding materials for layer transfer applications under various processing conditions. It has been shown that very high bond strengths are achievable with UDT for a short-time and low-temperature annealing. Bonding and device related shortcomings or difficulties are proven to be circumvented. Therefore, we propose the use of wafer bonding with UDT for the integration of layer transfer into the fabrication of microelectronic devices.