Performance and reliability of sub-100nm TaSiN metal gate fully-depleted SOI devices with high-k (HfO/sub 2/) gate dielectric

In this paper, we report the performance and reliability of sub-100nm TaSiN metal gate fully depleted SOI devices with high-k gate dielectric. Performance differences between fully-depleted and partially-depleted devices are highlighted. This is also the first time that an unique asymmetric degradation phenomenon between electron and hole mobility in metal/high-k devices is reported. Despite the use of high-k dielectric, we show that these devices exhibit superior reliability, noise and analog circuit performances.