Toward the integration of microsystems supply

This work presents a global methodology for the complete design of an integrated inductor. After describing the different existing topologies, a method providing the geometrical dimensions from the desired inductance value is reported. Then, the frequency dependency of the inductance and its parasitic capacitance and resistance are analyzed by means of specific CAD tools. A specific analysis of thermal failure mechanisms is presented next. Temperature and current density of different shapes of connection pad are subsequently studied.