A high throughput optoelectronic module assembly process

The throughput of die bonding machines, required to provide precise assembly alignment, is inversely and exponentially proportional to the accuracy required. Optoelectronic throughputs are much lower than pick and place assembly system throughputs due to the required alignment accuracy. This paper presents a technique for closing the gap in the assembly speed using passive alignment. The idea is to fabricate a silicon optical bench (SiOB) substrate where the semiconductors can be placed and tacked, utilizing conventional high speed placement equipment. The devices then passively align themselves into a highly accurate position during a subsequent batch reflow process. The SiOB substrate is aligned to the fiber core with the strategic use of crystal lattice etching techniques which provide both X and Y orientation of the components to the fiber. A second phase of this project is to take the SiOB substrate and attach it to a ferrule in a manner in which the ferrule is self aligned to the laser. By doing this, the device becomes an integral part of a connectorized unit. This is then the foundation for an active device module (ADM).