Giga-hertz electrical characteristics of flip-chip BGA package exceeding 2,000 pin counts

We have developed an FC-BGA (flip-chip BGA) package on a high-density organic substrate, achieving high pin count (exceeding 2,000 pins) and high speed operation. The data rate is over Gbit/s per channel, furthermore, the transmission rate continues increasing. In order to increase the rate per channel, differential signal transmission is normally adopted. But the eye opening becomes smaller and jitter becomes larger due to the transmission loss and the frequency response of the data pattern. Signals have wide bandwidth because the data pattern is at random. The Gbps transmission is achieved by decreasing the output jitter of the driver LSI, keeping the jitter tolerance in the unit interval (UI) of the receiver LSI and spreading the eye opening with reducing jitter. Also, it is necessary to supply stable power to control the plane resonance at the device activation frequency. In this study, we focused on the GHz electrical characteristics of system board and package to clarify the effect of the individual parts, by measurement and simulation, to realize the total model. The accurately constructed device model is very important over the GHz region for system level modeling.