Thick-film hybrid technology for low-output-voltage DC/DC converter

The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%).