A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips

A technique for fabricating multichip modules (MCMs) by mounting chips in holes etched into silicon motherboards is described. With this approach the front faces of the chips are coplanar with the front of the motherboard, and, hence, the connections between the chips and the motherboards may be made by standard thin-film processes. A method for fabricating such modules using electron beam lithography to locate the chips and to define the interconnections between the chips and the motherboard is discussed. The feasibility of the processes is demonstrated with measurements on a module designed and fabricated to test the stability of the processes.<
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