A Field Study of Connector Reliability

The objectives of this investigation were 1) to survey field support personnel on the reliability and use of connectors in electronic test and computer equipment; 2) to characterize the types of defects found on gold-plated edge card connector fingers from a large sample of printed wire assemblies (PWA's), obtained randomly from customer sites; and 3) to characterize the chemistry of the most prevalent defects found on the edge card connector fingers. The field support survey provided information on proper selection, use, and care of connectors used in electronic equipment. The microscopic examination of PWA edge card connector fingers indicated that the presence of a film covering the gold surface was the predominant defect found. Other defects observed included wear scratches, dust, pore corrosion, and a build up of debris at the metal-to-metal contact area. Defects such as edge corrosion and creep were observed, but on only very few PWA's. Chemical analysis of the film on the connector fingers found it to be primarily organic.