Surface Attach Chip Carriers for Conventional and High-Performance Applications

Three types of surface attach chip carriers are available for systems use: leadless ceramic and plastic packages, leaded plastic and ceramic packages, and a new updated version of the leadless ceramic packages suitable only for socketing. These new packages have high lead count, copper leads, and provisions for internal decoupling capacitors. These three packaging types and the important role that sockets play in system design are discussed.