Tilting out-of-plane platform for optical applications

In this paper we present a novel concept for a tiltable optical platform. The platform is electrostatically actuated using two vertical comb drives that run through the whole thickness of the wafer causing out-of-plane deflection. The platform measures 2/spl times/2 mm/sup 2/ with a through-hole of 1.6/spl times/1.8 mm/sup 2/. For a first demonstrator an optical filter showing an angular dependency of the reflected wavelength will be glued onto the platform in order to act as a channel add/drop device for telecom applications.