Forward body bias for microprocessors in 130nm technology generation and beyond

Device and test chip measurements show that forward body bias (FBB) can be used effectively to improve performance and reduce complexity of a 130nm dual-V/sub T/ technology, reduce leakage power during burn-in and standby, improve circuit delay and robustness, and reduce active power. FBB allows performance advantages of low temperature operation to be realized fully without requiring transistor redesign, and also improves V/sub T/ variations, mismatch, and g/sub m/ /spl times/ r/sub 0/ product.