Modeling of thermocouple based wafer temperature measurement in a radiantly-heated chamber

Using the Simulink/sup /spl reg// software package, a non-linear dynamic model has been created to simulate the heat transfer and temperature control in a down-stream plasma asher with radiant wafer heating. The input thermal parameters of the components are measured from the real asher chamber. This model has successfully simulated the behaviors of lamp power and thermocouple. With its block structure, the model can be easily expanded or updated with more sophisticated thermal modules.