Novel low temperature BaTiO/sub 3/ film capacitors

For embedded capacitor application, only dielectric materials with low processing temperature can be applied to printed wiring board manufacturing. Low temperature processable polymer/ceramic composites have been investigated to meet this need. The dielectric constant is a function of matrix and filler dielectric behavior, and the dielectric constant of highly filled composites is theoretically limited by the low dielectric value of the polymer matrix. In this investigation, we have developed a new amorphous low temperature processable matrix for use in dielectric composites. The new matrix processed at 300/spl deg/C was characterized to have a dielectric constant of 30. At a deposited thickness of 0.5 /spl mu/m, the capacitance density of the pure matrix film can reach 1500pF/mm/sup 2/ before addition of high dielectric constant filler.