Pattern dependent modeling of electroplated copper profiles

Copper electroplated profiles exhibit pattern dependent topography. We propose a methodology for the characterization and modeling of feature scale copper step heights and the height of copper array regions, as a function of layout parameters. The resulting empirical models with parameters extracted from conventional and super fill plating processes capture several key trends important in electroplating, and are the first step toward an integrated chip-scale copper plating/CMP simulation capability.