Micro connector fabricated by micro process technology

A fork-type micro connector with high aspect ratio and high package density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-138N) was used as a mold of Ni electroforming. The tips of plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact and precise connection of the micro connector, two-step guidance was adopted. The size of the terminal of fabricated micro connector was 50 /spl mu/m-thickness and 15 /spl mu/m-width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 /spl mu/m. A contact resistance of approximately 50 m/spl Omega/ was obtained by using four-point probe method.