Vertically interconnected 3D module for conformal phased array antennas

The development of a basic X-band 3D-IC/MEMS microwave transmit module is investigated for the possibility of conformal phased array technology. An innovative approach using microelectronics and MEMS processing technologies is implemented to develop 3D-IC processing technology. This allows us to investigate the technology development needed for minimum module depth to enable distribution on any arbitrary surface. For the initial phase, as a demonstration vehicle, a basic passive transmit module is designed, fabricated and characterized at microwave frequencies.