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Innovative Failure Analysis Techniques for 3-D Packaging Developments | IEEE Journals & Magazine | IEEE Xplore

Innovative Failure Analysis Techniques for 3-D Packaging Developments


Abstract:

Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging ...Show More

Abstract:

Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging techniques challenge the conventional PFA techniques and require new approaches. This article provides an overview of recent results in this domain achieved at Fraunhofer IWM.
Published in: IEEE Design & Test ( Volume: 33, Issue: 3, June 2016)
Page(s): 46 - 55
Date of Publication: 26 January 2016

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