Abstract:
Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging ...Show MoreMetadata
Abstract:
Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging techniques challenge the conventional PFA techniques and require new approaches. This article provides an overview of recent results in this domain achieved at Fraunhofer IWM.
Published in: IEEE Design & Test ( Volume: 33, Issue: 3, June 2016)