System level evaluation of Silicon imager based see-through Silicon application

This paper first reviews the novel technology which enables the silicon based imagers (CCD or CMOS) for see-through silicon inspection applications; then discusses a comprehensive mathematical model to simulate the inspection platform performances (resolution, throughput and cost) based on InGaAs cameras and Silicon cameras; at the end the feasibility and advantages of silicon imagers based inspection platforms for see-through silicon inspection applications is summarized.