Wavelets in Packaging, Interconnects, and EMC

In this chapter we study multiconductor, multilayered transmission lines (MMTL) employing quasi-static, quasi-dynamic, and full-wave analyses. We begin with the quasi-static formulation (QSF), which provides the parasitic capacitance, inductance, resistance, and conductance. We introduce an intermediate formulation between that of the quasi-static and full-wave, referred to as the quasi-dynamic formulation (QDF). Next, we present the full-wave analysis, from which we extract the scattering parameters. The emphasis of this chapter is given to packaging and interconnects of high-speed digital circuits and systems and the implementation of numerical algorithms using wavelets.