LeadFree Reflow and Rework

This chapter contains sections titled:

• Introduction

• Printability of Lead-Free Solder Pastes

• Soak Versus Ramp Temperature Profiles

• Effect of Peak Temperature Versus Reflow Performance

• Effect of Reflow Atmosphere on Solderability of Lead-Free Solder

• Convection Versus IR Reflow Ovens

• Reflow Temperature Delta on Boards and Components

• Visual Inspection of Lead-Free Soldered Joints

• Automated Optical Inspection (AOI)

• X-ray Inspection of Lead-Free Soldered Joints

• Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow

• Lead-Free Rework of BGA/CSP Soldered Joints

• Lead-Free Hand-Soldering Rework

• In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints

• Yield Data

• Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints

• Conclusions

• Future Work

• Acknowledgments

• References

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