A low cost MCM-D technology applied to microwave integrated circuits

The paper presents a new technological solution for fabricating microwave integrated circuits (MICs). This innovative approach is based on a deposited-multichip modules (MCM-D) technology developed at the R&D Centre of TELEBRAS. A description of the processing is presented and some results of MICs fabricated on alumina 96% are shown. The main features of this packaging technology are its low cost (< US$1.5/in/sup 2/), process simplification, reproducibility and microwave devices assembly compatibility. The paper demonstrates an easy solution for MICs fabrication that can be implemented with low investments.