On-chip high performance signaling using passive compensation

To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines(T-lines) is proposed and optimized in this paper. Firstly, we use passive compensation and repeated transceivers composed by sense amplifier and inverter chain to compensate the distortion and attenuation of on-chip T-lines. Secondly, an optimization flow for designing this scheme based on eye-diagram prediction and sequential quadratic programming (SQP) is proposed. This flow is employed to study the latency, power dissipation and throughput performance of the new global wiring scheme as the technology scales from 90nm to 22nm. Compared with conventional repeater insertion methods, our experimental results demonstrate that, at 22nm technology node, this new scheme reduces the normalized delay by 85.1%, the normalized energy consumption by 98.8%. Furthermore, all the performance metrics are scalable as the technology advances, which makes this new signaling scheme a potential candidate to break the “interconnect wall” of digital system performance.