Accelerated temperature cycle test and Coffin-Manson model for electronic packaging

Temperature cycle profiles at various stress levels were investigated for accelerated reliability testing of electronic device packaging. Failure analysis was conducted for test failures to determine their root cause failure mechanisms and failure modes. Weibull analysis was conducted for failures with the main failure mechanisms (such as solder fatigue, mechanical cracks). The Coffin-Manson model has been used to model crack growth due to repeated temperature cycling. A good correlation was obtained between the Coffin-Manson model and the test results, and activation energy (EA) was determined. The limitation and application of the Coffin-Manson model are further discussed. The Coffin-Manson model with determined activation energy could be used to estimate product reliability under different application conditions for the same main failure mechanism.