Experience report on the FIDES reliability prediction method

This paper examines predicted failure rates for three circuit card assemblies (CCA's) using the new FIDES prediction methodology. These results are compared to observed field failure rates, as well as predicted failure rates derived from MIL-HDBK 217, Reliability Prediction of Electronic Equipment, and the PRISM/spl reg/ prediction software tool that become satisfactory. The FIDES prediction methodology, implemented in Excel workbooks, is easy to use and according to our preliminary study, appears to be an accurate prediction tool.