De-embedding and EM simulations for microstrip over lossy silicon

We summarize several de-embedding techniques and propose an approach using a 2-impedance model, which has one shunt and one series impedance that gives consistent results when applied to three different lengths of microstrip. We also discuss results on microstrip lines having a ground metal thickness less than a skin depth, and show the impact of the layers below thin grounds on simulations. Very good agreement is obtained between simulated and de-embedded measured results.