Circuitmodelsforpowerbusstructuresonprintedcircuitboards using a hybrid FEM-SPICE method
Chunlei Guo
Hubing, T.H.
Dept. of Electr. & Comput. Eng., Univ. of Missouri-Rolla, Rolla, MO
This paper appears in: Advanced Packaging, IEEE Transactions on Publication Date: Aug. 2006
Volume: 29
,
Issue: 3
On page(s):
441
- 447
Location: West Point, NY, USA
ISSN: 1521-3323
Digital Object Identifier: 10.1109/TADVP.2006.875089
Current Version Published: 2006-08-07
Abstract
Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method
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