Minjia Xu
Hubing, T.H.
Hewlett-Packard, San Diego, CA, USA
This paper appears in: Advanced Packaging, IEEE Transactions on Publication Date: Aug. 2002
Volume: 25
,
Issue: 3
On page(s):
424
- 432
ISSN: 1521-3323
Digital Object Identifier: 10.1109/TADVP.2002.806733
Current Version Published: 2003-01-22
Abstract
Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed circuit boards with embedded capacitance.
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