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		<title><![CDATA[ Microwave Magazine, IEEE - new TOC ]]></title>
		<link>http://ieeexplore.ieee.org</link>
		<description>TOC Alert for Publication# 6668 </description>
		<year>2013</year>
		<month>May      </month>
		<day>21</day>
		<item>
			<title><![CDATA[[Front cover]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512695]]></link>
			<description><![CDATA[Presents the front cover for this issue of the magazine.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512695]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>C1</startPage>
			<endPage>C1</endPage>
			<fileSize>905</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Table of Contents]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512624]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512624]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>3</startPage>
			<endPage>4</endPage>
			<fileSize>1154</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Society listing]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512696]]></link>
			<description><![CDATA[Provides a listing of current committee members and society officers.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512696]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>3</startPage>
			<endPage>3</endPage>
			<fileSize>566</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Musings [From the Editor's Desk]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512625]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512625]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>6</startPage>
			<endPage>12</endPage>
			<fileSize>6925</fileSize>
			<authors><![CDATA[Wood, J.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Volunteering for a Professional Society [President's Column]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512612]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512612]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>14</startPage>
			<endPage>22</endPage>
			<fileSize>9264</fileSize>
			<authors><![CDATA[Gupta, M.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Comment on "Propagation and Negative Refraction" [Backscatter]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512645]]></link>
			<description><![CDATA[Hunter et al. in the above-named article (ibid., vol. 13, no. 5, pp. 58-65, July/Aug. 2012) have recently presented a confusing interpretation of the phenomenon of negative refraction in metamaterials. In the first part of their article, the authors make bold and general claims that negative refraction is not possible at a single interface due to causality issues. They attempt to explain the decade??old experimental and numerical evidence of negative refraction with a couple of paragraphs on the premise that this is only possible in the case of a finite??thickness slab based on modal interference. To support their claim, the authors continue by proposing an even/odd mode analysis, which would presumably explain all the observed negative refraction phenomena. They then go on applying this theory to lumped??circuit networks and to specific metamaterial geometries that have successfully reported negative refraction based on a variety of different phenomena. In this comment, we would like to clarify and rectify several misleading statements appearing in their article and straighten the physical meaning and underlying phenomena behind negative??refraction and negative index metamaterials.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512645]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>24</startPage>
			<endPage>30</endPage>
			<fileSize>6883</fileSize>
			<authors><![CDATA[Eleftheriades, G.V.;Alu, A.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Response to Comment on ?Propagation and Negative Refraction? [Backscatter]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512711]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512711]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>30</startPage>
			<endPage>33</endPage>
			<fileSize>12120</fileSize>
			<authors><![CDATA[Hunter, I.;Abunjaileh, A.;Rhodes, J.;Snyder, R.;Meng, M.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Leadership! What Does That Even Mean? [MicroBusiness]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512643]]></link>
			<description><![CDATA[Many years ago, my new boss posed a question to me. After a shake-up, he had taken over as manager of our division and was trying to decide if the organization needed to be changed. We had one, very large department, and he was thinking about breaking it up. I felt that it should be kept intact. He was concerned that it was too large to be managed effectively by one person. He asked how one person could manage it successfully. I answered ?leadership!? To which he asked ?what does that even mean??]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512643]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>34</startPage>
			<endPage>36</endPage>
			<fileSize>2177</fileSize>
			<authors><![CDATA[Schindler, F.;]]></authors>
		</item>
		<item>
			<title><![CDATA[The Annual Exam [Microwave Surfing]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512642]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512642]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>38</startPage>
			<endPage>163</endPage>
			<fileSize>9089</fileSize>
			<authors><![CDATA[Bansal, R.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Safety Risks from Cell Phones Needs Review [Health Matters]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512714]]></link>
			<description><![CDATA[The CTIA, an organization representing the wireless communications industry, stated in a news release [1], ?CTIA welcomes the Federal Communications Commission?s (FCC?s) continued careful oversight of this issue,? in its response to the Government Accountability Office (GAO) report on cell phone safety [2]. The GAO recommended the FCC to reassess and, if appropriate, change its current RF exposure safety rules. It also mentioned that the FCC is working on a draft document that has the potential to address the GAO?s recommendations.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512714]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>42</startPage>
			<endPage>46</endPage>
			<fileSize>6377</fileSize>
			<authors><![CDATA[Lin, J.C.;]]></authors>
		</item>
		<item>
			<title><![CDATA[This Emperor Has No Clothes? [Microwave Bytes]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512701]]></link>
			<description><![CDATA[Well, not many anyway. With more than 40 years of experience in wireless communications technology and its associated hardware construction, I find the current flurry of interest in orthogonal frequency division modulation (OFDM) actually rather quaint. For example, it is amazing to me that the extremely revolutionary nature of this signal class is actually poorly understood, particularly by the academic community. On the industrial side, there is a general misunderstanding of the economic consequences of building hardware needed to generate and receive an OFDM signal. In my entire career I have never encountered a signal type that has such a bimodal interest distribution-some adherents love it, and there are others who cannot loathe it more. Exploring this most interesting development is the purpose of this column.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512701]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>48</startPage>
			<endPage>62</endPage>
			<fileSize>14603</fileSize>
			<authors><![CDATA[Mccune, E.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Implantable RF Medical Devices: The Benefits of High-Speed Communication and Much Greater Communication Distances in Biomedical Applications]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512716]]></link>
			<description><![CDATA[In the early ages of implantable devices, radio frequency (RF) technologies were not commonplace due to the challenges stemming from the inherent nature of biological tissue boundaries. As technology improved and our understanding matured, the benefit of RF in biomedical applications surpassed the implementation challenges and is thus becoming more widespread. The fundamental challenge is due to the significant electromagnetic (EM) effects of the body at high frequencies. The EM absorption and impedance boundaries of biological tissue result in significant reduction of power and signal integrity for transcutaneous propagation of RF fields. Furthermore, the dielectric properties of the body tissue surrounding the implant must be accounted for in the design of its RF components, such as antennas and inductors, and the tissue is often heterogeneous and the properties are highly variable. Additional challenges for implantable applications include the need for miniaturization, power minimization, and often accounting for a conductive casing due to biocompatibility and hermeticity requirements [1]?[3]. Today, wireless technologies are essentially a must have in most electrical implants due to the need to communicate with the device and even transfer usable energy to the implant [4], [5]. Low-frequency wireless technologies face fewer challenges in this implantable setting than its higher frequency, or RF, counterpart, but are limited to much lower communication speeds and typically have a very limited operating distance. The benefits of high-speed communication and much greater communication distances in biomedical applications have spawned numerous wireless standards committees, and the U.S. Federal Communications Commission (FCC) has allocated numerous frequency bands for medical telemetry as well as those to specifically target implantable applications. The development of analytical models, advanced EM simulation software, and representative RF human phantom recipes h-
s significantly facilitated design and optimization of RF components for implantable applications.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512716]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>64</startPage>
			<endPage>73</endPage>
			<fileSize>2692</fileSize>
			<authors><![CDATA[Chow, E.Y.;Morris, M.M.;Irazoqui, P.P.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Easy-to-swallow antenna and propagation]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512691]]></link>
			<description><![CDATA[The first part of this series [ibid., vol. 13, pp. 90??101, Sept.??Oct. 2012] reviewed recent developments in the design of wireless telemetry units for electronic pill technology and discussed the challenges and developments for successful implementation of high-resolution video-based electronic pills. This second part reviews potential miniature antenna modules that fit inside the electronic pills and discusses propagation analysis of RF signals through the dense in-body environment.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512691]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>74</startPage>
			<endPage>82</endPage>
			<fileSize>2338</fileSize>
			<authors><![CDATA[Yuce, M.R.;Dissanayake, T.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Transistor Modeling: Robust Small-Signal Equivalent Circuit Extraction in Various HEMT Technologies]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512720]]></link>
			<description><![CDATA[Small-signal equivalent circuit (SSEC) models prove indispensable to a broad range of activities, ranging from the understanding of device physics, the analysis of device performance, the characterization and comparison of fabrication processes, the bottom-up construction of large-signal models, the extraction of intrinsic noise parameters, and the design of monolithic microwave integrated circuits (MMICs). Because the SSEC model links the physical structure of the device to its circuit behavior, it allows analysis of the microwave performance as a function of the device geometry. A physically representative model can therefore be used for frequencies extending beyond those of the measurement setup. One must keep in mind that a model is only a physical approximation of a given device, and the more we demand of a model, the more likely we are to expose its various shortcomings. For example, one can stress the limits of a model by extending its frequency range or by applying it to dissimilar technologies; experience shows that with newer material systems, models tend to provide poorer fits to the measured data. In the course of our work, we specifically investigated differences brought about by different materials for devices implemented with a given mask set.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512720]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>83</startPage>
			<endPage>101</endPage>
			<fileSize>2260</fileSize>
			<authors><![CDATA[Alt, A.R.;Marti, D.;Bolognesi, C.R.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Parallel Programming with GPUs: Parallel Programming Using Graphics Processing Units with Numerical Examples for Microwave Engineering]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512721]]></link>
			<description><![CDATA[Scientific parallel programming has become mainstream in recent years by the introduction of high-performance graphics processing units (GPUs) that are specifically designed for numerical processing. In addition, freely available programming tools have made it possible for anyone who wants to leverage the processing power of GPUs to do so relatively easily. This article provides an introduction to parallel programming using GPUs with numerical examples demonstrating the speedup that can be obtained in a microwave engineering problem. All programming tools that are used in the article can be obtained free-of-charge from online resources. This accessibility is a tremendous benefit to engineers, students, and enthusiasts.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512721]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>102</startPage>
			<endPage>115</endPage>
			<fileSize>4053</fileSize>
			<authors><![CDATA[Kinayman, N.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Harmonic Load-Pull Techniques: An Overview of Modern Systems]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512665]]></link>
			<description><![CDATA[The characterization of microwave devices under nonlinear conditions is fundamental for device technology development, to improve device large signal model accuracy and reliability, as well as an essential tool to support the design of power amplifiers (PAs). Since the input and output device terminations at fundamental and harmonics frequencies play a crucial role to set the device behaviors and performances, load-pull (LP) measurements are today one of the prominent characterization solutions at RF, micro-, and millimeter waves. In this article, a concise but comprehensive overview of the most important LP techniques available today is presented and pros and cons of the several approaches are highlighted and discussed.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512665]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>116</startPage>
			<endPage>123</endPage>
			<fileSize>3770</fileSize>
			<authors><![CDATA[Ferrero, A.;Pirola, M.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Low-Cost Microwave Power Generator for Scientific and Medical Use [Application Notes]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512680]]></link>
			<description><![CDATA[Microwave generators are used in medical and scientific applications for heating or generating nonthermal effects. Such generators require fine output power and phase control to be able to control the focalization of the microwaves in the samples. They must also be able to generate continuous or pulsed microwave radiation. The spectral purity of the microwave output signal is usually not important as long as the generator will not produce large second- and third-order harmonics. Basically, all the energy in the microwave radiation spectrum contributes to the heating process. The microwaves are radiated into the sample through different configuration applicators using the industrial, scientific, and medical (ISM) frequency bands. A large range of power control is necessary if both thermal and nonthermal microwave effects are sought to be induced alternately during the treatment period. Such generators are rather expensive and difficult to find as spare parts. The idea of using second generation (2G) NOS components is based on the observation that stock suppliers have low-cost, large amounts of 2G components, used mainly in Global System for Mobile Communications (GSM) phones and related network equipment, while the silicon RF power transistors, available on the market today, have excessive prices. Could we use the huge GSM new old stock (NOS) components with good performance in other applications than they were designed for?]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512680]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>124</startPage>
			<endPage>130</endPage>
			<fileSize>3920</fileSize>
			<authors><![CDATA[Surducan, V.;Surducan, E.;]]></authors>
		</item>
		<item>
			<title><![CDATA[A Millimeter-Wave Imager Using an Illuminating Source [Application Notes]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512657]]></link>
			<description><![CDATA[The properties of millimeter waves (MMWs) provide security systems based on this technology with a considerable advantage when compared to other security and surveillance systems. We highlight their ability to penetrate clothing and other common materials [1], their imaging capability under adverse weather conditions during the day and night, and their low free-space attenuation and high spatial resolution. These advantages are increasing the use of MMW imaging systems in security applications to protect the security of civilian (train and underground stations, airports, government buildings, etc.) and military facilities (military bases, checkpoints, etc.), as well as people themselves.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512657]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>132</startPage>
			<endPage>138</endPage>
			<fileSize>1471</fileSize>
			<authors><![CDATA[Gomez-Maqueda, I.;Almorox-Gonzalez, P.;Callejero-Andres, C.;Burgos-Garcia, M.;]]></authors>
		</item>
		<item>
			<title><![CDATA[RWW2014]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512694]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512694]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>133</startPage>
			<endPage>133</endPage>
			<fileSize>301</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[BioWireless]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512725]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512725]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>139</startPage>
			<endPage>139</endPage>
			<fileSize>332</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Fire! fire! fire! [fire that destroyed the James Clerk Maxwell home]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6513325]]></link>
			<description><![CDATA[It is 1929. A fire has started in the kitchen. The firemen come, but there is no water. All they can do is help carry furniture out of the house. After the fire fades and the extensive damage becomes apparent, the home is abandoned. Later attempts to preserve the remains fail. Glenlair, home to one of the greatest physicists ever, James Clerk Maxwell, might be lost forever. Figures 1?3 show how it looked during my first visit in July 2005. Depressing.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6513325]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>140</startPage>
			<endPage>150</endPage>
			<fileSize>25854</fileSize>
			<authors><![CDATA[Rautio, J.C.;]]></authors>
		</item>
		<item>
			<title><![CDATA[MTT-Society Fellows of 2013: 25 Members of MTT-S Elected to Fellow of the IEEE in 2013]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512723]]></link>
			<description><![CDATA[The IEEE grade of Fellow is conferred by the IEEE Board of Directors upon a person with an outstanding record of accomplishments in any of the IEEE fields of interest. The total number selected in any one year cannot exceed one-tenth of 1% of the total voting membership. IEEE Fellow is the highest grade of membership and is recognized by the technical community as a prestigious honor and an important career achievement. There were 298 individuals elevated to IEEE Fellow for 2013. Of these 298, ten Fellows were evaluated by the MTT-Society (MTT-S) as their primary affiliation in IEEE. Their citations and biographies appear here, with some selected highlight achievements, along with portrait photographs so that you can congratulate them on their election to Fellow in person when you meet them at conferences or other meetings. There are a further 15 members of the MTT-S who were elevated to the class of Fellow in 2013, but were evaluated by other Societies. Their names and citations appear after.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512723]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>151</startPage>
			<endPage>161</endPage>
			<fileSize>1304</fileSize>
			<authors><![CDATA[Wood, J.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Publishing at IMS - Part I: How to get your paper published at IMS]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512632]]></link>
			<description><![CDATA[My host firmly told me, "It's just an Old Boy's Club." We were talking about getting papers accepted to the IEEE MTT-S International Microwave Symposium (IMS). After several rejections, he no longer submitted papers to IMS. This is a real shame because IMS is the premier RF/microwave conference in the world. His perception was that the IMS Technical Paper Review Committee (TPRC), consisting of more than 250 of the world's leading RF/microwave researchers, gave favored status to its own members.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512632]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>162</startPage>
			<endPage>163</endPage>
			<fileSize>348</fileSize>
			<authors><![CDATA[Rautio, J.C.;]]></authors>
		</item>
		<item>
			<title><![CDATA[The IMS Ph.D. Students Sponsorship Initiative [Education News]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512698]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512698]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>164</startPage>
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			<fileSize>772</fileSize>
			<authors><![CDATA[Abunjaileh, A.;Schreurs, D.;]]></authors>
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		<item>
			<title><![CDATA[The MTT-S MGA and Education Committees Are Prepared to Assist Your Chapter, the Moscow Joint Chapter Activity Is an Example [Education News]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512731]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512731]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>165</startPage>
			<endPage>178</endPage>
			<fileSize>486</fileSize>
			<authors><![CDATA[Machac, J.;Pasquet, D.;Schreurs, D.;]]></authors>
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		<item>
			<title><![CDATA[Report on Photonics West Show [Conference Report]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512689]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512689]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>166</startPage>
			<endPage>166</endPage>
			<fileSize>731</fileSize>
			<authors><![CDATA[Siegel, P.H.;]]></authors>
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		<item>
			<title><![CDATA[IMARC 2013]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512677]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512677]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>167</startPage>
			<endPage>167</endPage>
			<fileSize>417</fileSize>
			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[More Power [Book/Software Reviews]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512675]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512675]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>168</startPage>
			<endPage>178</endPage>
			<fileSize>505</fileSize>
			<authors><![CDATA[Riddle, A.;]]></authors>
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		<item>
			<title><![CDATA[INMMIC Leuven]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512681]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512681]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>169</startPage>
			<endPage>169</endPage>
			<fileSize>613</fileSize>
			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[[MTT-S Ombuds Officer]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512728]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512728]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>170</startPage>
			<endPage>172</endPage>
			<fileSize>1013</fileSize>
			<authors><![CDATA[Niehenke, E.C.;]]></authors>
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		<item>
			<title><![CDATA[IWS 2014]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512673]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512673]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>173</startPage>
			<endPage>173</endPage>
			<fileSize>206</fileSize>
			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[Microwave New Products [New Products]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512683]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512683]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>174</startPage>
			<endPage>178</endPage>
			<fileSize>2401</fileSize>
			<authors><![CDATA[Majerus, M.;]]></authors>
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		<item>
			<title><![CDATA[PAWR]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512644]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512644]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>177</startPage>
			<endPage>177</endPage>
			<fileSize>294</fileSize>
			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[Ken Lakin [In Memoriam]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512660]]></link>
			<description><![CDATA[Recounts the life and professional achievements of Ken Lakin. Kenneth Lakin was born on 14 January 1941 in Grand Rapids, Michigan, USA. He graduated from the University of Michigan with B.S. and M.S. degrees in physics, mathematics, and electrical engineering and received his Ph.D. in applied physics from Stanford University in 1969. Dr. Lakin made pioneering contributions to microwave acoustic materials, devices, and applications, where he introduced consistently new and innovative ideas. He worked in the microwave acoustic field for more than 40 years, and his work significantly advanced the state of the art. He is probably best known for his following achievements: He played a key role in the successful demonstration of the use of aluminum nitride as a material for microwave acoustic applications; He demonstrated the first FBAR device in the early eighties, the socalled solidly mounted resonator (SMR). Dr. Lakin passed away on 24 November 2012.]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512660]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>179</startPage>
			<endPage>179</endPage>
			<fileSize>201</fileSize>
			<authors><![CDATA[Hausner, J.;]]></authors>
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		<item>
			<title><![CDATA[[Conference Calendar]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512688]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512688]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>180</startPage>
			<endPage>180</endPage>
			<fileSize>287</fileSize>
			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[Pearls Before Swine]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512733]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512733]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>182</startPage>
			<endPage>182</endPage>
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			<authors><![CDATA[]]></authors>
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		<item>
			<title><![CDATA[The Grammar Police Are Here [Microwave Bytes Back]]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512682]]></link>
			<description><![CDATA[ ]]></description>
			<pubDate><![CDATA[June  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6512682]]></guid>
			<volume>14</volume>
			<issue>4</issue>
			<startPage>184</startPage>
			<endPage>182</endPage>
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			<authors><![CDATA[Wood, J.;]]></authors>
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