<![CDATA[ Electronics Packaging Manufacturing, IEEE Transactions on - new TOC ]]> http://ieeexplore.ieee.org TOC Alert for Publication# 6104 2011 November 15 <![CDATA[Table of contents]]> 33 4 C1 C1 39 <![CDATA[IEEE Transactions on Electronics Packaging Manufacturing publication information]]> 33 4 C2 C2 38 <![CDATA[Editorial - CPMT Society to Merge Transactions in 2011]]> 33 4 241 242 160 <![CDATA[List of Reviewers]]> 33 4 243 243 23 <![CDATA[An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform Optics]]> 33 4 244 254 1699 <![CDATA[Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds]]> 33 4 255 264 2029 <![CDATA[Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis]]> 33 4 265 274 1508 <![CDATA[Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils]]> 33 4 275 283 3454 <![CDATA[Signal Integrity Enhanced EBG Structure With a Ground Reinforced Trace]]> 33 4 284 288 1051 <![CDATA[Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems]]> 33 4 289 302 2140 <![CDATA[Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach]]> 33 4 303 311 909 <![CDATA[Table of contents]]> 33 4 312 312 59 <![CDATA[Table of contents]]> 33 4 313 314 45 <![CDATA[2010 Index IEEE Transactions on Electronics Packaging Manufacturing Vol. 33]]> 33 4 315 322 81 <![CDATA[IEEE Foundation]]> 33 4 323 323 320 <![CDATA[Leading the field since 1884]]> 33 4 324 324 223 <![CDATA[IEEE Components, Packaging, and Manufacturing Technology Society information for authors]]> 33 4 C3 C3 34 <![CDATA[IEEE Components, Packaging, and Manufacturing Technology Society Information]]> 33 4 C4 C4 31