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		<title><![CDATA[ Micro, IEEE - new TOC ]]></title>
		<link>http://ieeexplore.ieee.org</link>
		<description>TOC Alert for Publication# 40 </description>
		<year>2013</year>
		<month>May      </month>
		<day>16</day>
		<item>
			<title><![CDATA[Front Cover]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504450]]></link>
			<description><![CDATA[Front Cover]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504450]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>c1</startPage>
			<endPage>c1</endPage>
			<fileSize>4871</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Table of Contents]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504451]]></link>
			<description><![CDATA[Table of Contents]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504451]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>c2</startPage>
			<endPage>1</endPage>
			<fileSize>594</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Optical Interconnects and Their Implications]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504443]]></link>
			<description><![CDATA[This column discusses issues surrounding optical interconnect, particularly the implications that may occur if optical interconnect is available and practical in two generations.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504443]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>2</startPage>
			<endPage>2</endPage>
			<fileSize>856</fileSize>
			<authors><![CDATA[Altman, Erik R.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Special Issue: Selected Research from the First Optical Interconnects Conference]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504444]]></link>
			<description><![CDATA[This introduction to the special issue summarizes the creation of the first Optical Interconnects Conference, discusses some key themes in the field, and introduces the seven articles included in the special issue.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504444]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>3</startPage>
			<endPage>5</endPage>
			<fileSize>1474</fileSize>
			<authors><![CDATA[Kash, Jeffrey A.;Beausoleil, Raymond G.;]]></authors>
		</item>
		<item>
			<title><![CDATA[High-Bandwidth Optical Interconnect Technologies for Next-Generation Server Systems]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6375712]]></link>
			<description><![CDATA[High-bandwidth optical interconnect is a key technology for high-performance computing. This article describes a proposed architecture for next-generation blade servers and optical transceivers required to realize the architecture. It describes the key technologies for high-bandwidth optical transceivers. A new compact optical transceiver with a high bandwidth of 200 Gbps (8 channels &#x00D7; 25 Gbps) is demonstrated using the developed technologies.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6375712]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>6</startPage>
			<endPage>13</endPage>
			<fileSize>1839</fileSize>
			<authors><![CDATA[Tanaka, K.;Ide, S.;Tsunoda, Y.;Shiraishi, T.;Yagisawa, T.;Ikeuchi, T.;Yamamoto, T.;Ishihara, T.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Optical Interconnects for High-Performance Computing Systems]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6357173]]></link>
			<description><![CDATA[A first step toward advanced optical interconnect technologies is a data-center switch using a multibus optical backplane. This network switch replaces the electronic backplane and communications fabric application-specific integrated circuit (ASIC) with an optical fabric based on multiple optical broadcast buses. The prototype demonstrated reliable performance, and the optical bus can scale to much higher bandwidths. Thus, network switches using optical backplanes have significant advantages for future systems.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6357173]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>14</startPage>
			<endPage>21</endPage>
			<fileSize>2188</fileSize>
			<authors><![CDATA[Tan, M.R.T.;McLaren, M.;Jouppi, N.P.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Hybrid Silicon Devices for Energy-Efficient Optical Transmitters]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6353406]]></link>
			<description><![CDATA[Decreasing energy limits for data transport have resulted in efforts to reduce energy consumption in optical interconnects. The authors introduce three possible integration techniques for realizing a hybrid silicon transmitter on a single chip with distributed feedback (DFB) lasers and electro-absorption modulators. They review the current bottlenecks and techniques for further reducing threshold current and increasing the wall-plug efficiency of these lasers.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6353406]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>22</startPage>
			<endPage>31</endPage>
			<fileSize>2083</fileSize>
			<authors><![CDATA[Srinivasan, S.;Tang, Y.;Read, G.;Hossain, N.;Liang, D.;Sweeney, S.J.;Bowers, J.E.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Monolithic Silicon Waveguides in Standard Silicon]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6374191]]></link>
			<description><![CDATA[A methodology allows fabrication of silicon-photonic devices in standard silicon wafers, eliminating the need for silicon-on-insulator (SOI) wafers. Using this technology, the authors demonstrate low-loss silicon waveguides (2.34 dB/cm), comparable to conventional SOI channel waveguides. The ease and flexibility of this fabrication method simplify integration of electronics and photonics and make it a possible alternative to SOI-based technology for implementation of silicon-photonic devices and systems.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6374191]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>32</startPage>
			<endPage>40</endPage>
			<fileSize>2731</fileSize>
			<authors><![CDATA[Chia-Ming Chang;Solgaard, O.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Certification House Advertisement]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504445]]></link>
			<description><![CDATA[Certification House Advertisement]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504445]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>41</startPage>
			<endPage>41</endPage>
			<fileSize>3151</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Bit-Error-Rate Monitoring for Active Wavelength Control of Resonant Modulators]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6336694]]></link>
			<description><![CDATA[A new method uses bit-error-rate measurements to acquire and stabilize the wavelength of an optical resonant modulator to an optical carrier wave. This is attractive because it uses the pertinent metric, bit error rate, to optimize the modulator resonance independent of other system variations, meaning it can compensate for system aging and drift even in the heater element itself.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6336694]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>42</startPage>
			<endPage>52</endPage>
			<fileSize>6951</fileSize>
			<authors><![CDATA[Zortman, W.A.;Lentine, A.L.;Trotter, D.C.;Watts, M.R.;]]></authors>
		</item>
		<item>
			<title><![CDATA[IEEE Open Access Publishing House Advertisement]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504446]]></link>
			<description><![CDATA[IEEE Open Access Publishing House Advertisement]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504446]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>53</startPage>
			<endPage>53</endPage>
			<fileSize>1275</fileSize>
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		</item>
		<item>
			<title><![CDATA[Silicon Photonic Microring Links for High-Bandwidth-Density, Low-Power Chip I/O]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6407466]]></link>
			<description><![CDATA[Silicon photonic microrings have drawn interest in recent years as potential building blocks for high-bandwidth off-chip communication links. The authors analyze a terabit-per-second scale unamplified microring link based on current best-of-class devices. The analysis provides quantitative measures for the achievable energy efficiency and bandwidth density that could be realized within several years. The results highlight key device attributes that require significant advancement to realize sub-pJ/bit scale optical links.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6407466]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>54</startPage>
			<endPage>67</endPage>
			<fileSize>892</fileSize>
			<authors><![CDATA[Ophir, N.;Mineo, C.;Mountain, D.;Bergman, K.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Silicon Photonic Interconnects for Large-Scale Computer Systems]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6353407]]></link>
			<description><![CDATA[Optical interconnects play an integral role in large-scale digital computing, switching, and routing systems. The authors describe a path toward future many-chip modules based on silicon photonic interposers that stitch together tens of chips in a dense and efficient communication infrastructure. They review the guiding design principles for this "macrochip" and describe its canonical energy, loss, and area budgets.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6353407]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>68</startPage>
			<endPage>78</endPage>
			<fileSize>3390</fileSize>
			<authors><![CDATA[Ho, R.;Amberg, P.;Chang, E.;Koka, P.;Lexau, J.;Guoliang Li;Liu, F.Y.;Schwetman, H.;Shubin, I.;Thacker, H.D.;Xuezhe Zheng;Cunningham, J.E.;Krishnamoorthy, A.V.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Corporate Affiliate Program House Advertisement]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504447]]></link>
			<description><![CDATA[Corporate Affiliate Program House Advertisement]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504447]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>79</startPage>
			<endPage>79</endPage>
			<fileSize>756</fileSize>
			<authors><![CDATA[]]></authors>
		</item>
		<item>
			<title><![CDATA[Security of Autonomous Systems Employing Embedded Computing and Sensors]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504448]]></link>
			<description><![CDATA[Embedded computing and sensor systems are increasingly becoming an integral part of today's infrastructure. From jet engines to vending machines, our society relies on embedded computing and sensor systems to support numerous applications seamlessly and reliably. This is especially true with respect to autonomous systems such as unmanned aircraft, unmanned ground vehicles, robotics, medical operations, and industrial automation. However, given society's increasing reliance on embedded computing and sensor systems as well as the applications they support, this introduces a new form of vulnerability into this critical infrastructure that is only now beginning to be recognized as a significant threat with potentially serious consequences. This column presents the latest insights on the technical challenges and opportunities associated with the security of autonomous systems from an embedded computing and sensors perspective.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504448]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>80</startPage>
			<endPage>86</endPage>
			<fileSize>1238</fileSize>
			<authors><![CDATA[Wyglinski, A.M.;Xinming Huang;Padir, T.;Lifeng Lai;Eisenbarth, T.R.;Venkatasubramanian, K.;]]></authors>
		</item>
		<item>
			<title><![CDATA[Gaming Structure]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504449]]></link>
			<description><![CDATA[This column examines whether the rise in smartphone, tablet, and social media use have upended the structure of the gaming market.]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504449]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>88</startPage>
			<endPage>88</endPage>
			<fileSize>185</fileSize>
			<authors><![CDATA[Greenstein, Shane;]]></authors>
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			<title><![CDATA[Software House Advertisement]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504452]]></link>
			<description><![CDATA[Software House Advertisement]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504452]]></guid>
			<volume>33</volume>
			<issue>1</issue>
			<startPage>c3</startPage>
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			<title><![CDATA[Focused on Your Future House Advertisement]]></title>
			<link><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504453]]></link>
			<description><![CDATA[Focused on Your Future House Advertisement]]></description>
			<pubDate><![CDATA[Jan.-Feb.  2013]]></pubDate>
			<guid><![CDATA[http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6504453]]></guid>
			<volume>33</volume>
			<issue>1</issue>
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