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TOC Alert for Publication# 15 2017November 23<![CDATA[Table of Contents]]>602C129750<![CDATA[IEEE Electromagnetic Compatibility Society]]>602C2C256<![CDATA[Determination of Equivalent Coupling Surface of Passive Components Using the TEM Cell]]>6022983092553<![CDATA[System Level ESD Coupling Analysis Using Coupling Transfer Impedance Function]]>$ABCD$ parameters are calculated from the measured (simulated) $S$-parameters of the equipment under test (EUT). The transfer function of the system level ESD coupling is derived from the $ABCD$-parameters. The derived transfer function estimates the induced coupling to the EUT quite well for the input ESD stressing. For the ESD source modeling, a novel simple and efficient circuit model of ESD generator is also presented. A good agreement is obtained between the measured and simulated results based on derived coupling transfer impedance function. The proposed method permits the efficient ESD coupling analysis without the need of additional electromagnetic modeling of EUT and ESD generator for various ESD input voltage levels.]]>6023103211779<![CDATA[New Integrated Crystal Oscillator Design With Improved Robustness Against ESD Disturbances in Operation]]>6023223271292<![CDATA[On the Use of Conformal Models and Methods in Dosimetry for Nonuniform Field Exposure]]>602328337948<![CDATA[Radiated Emissions of an Array of OLED Luminaries]]>6023383461029<![CDATA[Accurate Computation of Internal Impedance of Two-Layer Cylindrical Conductors for Arguments of Arbitrary Magnitude]]>602347353561<![CDATA[Self-Calibrating Noniterative Complex Permittivity Extraction of Thin Dielectric Samples]]>$varepsilon _r$) of thin dielectric samples. It has the following two main advantages. First, it takes into account effect of the sample holder, used for holding the sample, especially important for thin sample electromagnetic property characterization. Second, it does not require any specific information about the location of the sample (and its holder) inside its measurement cell for $varepsilon _r$ extraction. For validation of our method, we applied a commercial three-dimensional electromagnetic simulation program—CST Microwave Studio—and the Lorentz dispersion model. Uncalibrated (as well as calibrated) S-parameter measurements were conducted to measure $varepsilon _r$ of a 0.7 mm thick polyethylene sample (the sample holder was a 5.18 mm thick PVC sample) by our method and other similar methods in the literature. From the comparison, we observed that while the accuracy of tested methods significantly changed with inaccurate knowledge of the sample position inside its cell, the accuracy of our method did not much alter.]]>602354361963<![CDATA[Analyzing the Shielding Effectiveness of a Graphene-Coated Shielding Sheet by Using the HIE-FDTD Method]]>602362367662<![CDATA[Broadband Circuit Model for Electromagnetic-Interference Analysis in Metallic Enclosures]]>6023683751081<![CDATA[Electromagnetic Shielding Effectiveness of Layered Polymer Nanocomposites]]>602376384933<![CDATA[Study of the Propagation of Common Mode IEMI Signals Through Concrete Walls]]>6023853931620<![CDATA[Reduction of Electromagnetic Noise Coupling to Antennas in Metal-Framed Smartphones Using Ferrite Sheets and Multi-Via EBG Structures]]>6023944011188<![CDATA[Integration of Energy Balance of Soil Ionization in CIGRE Grounding Electrode Resistance Model]]>6024024131917<![CDATA[A Low-Cost System for Measuring Lightning Electric Field Waveforms, its Calibration and Application to Remote Measurements of Currents]]>6024144221432<![CDATA[Near-Field Validation of Dipole-Moment Model Extracted From GTEM Cell Measurements and Application to a Real Application Processor]]>6024234346520<![CDATA[An FDTD Method for the Transient Terminal Response of Twisted-Wire Pairs Illuminated by an External Electromagnetic Field]]>602435443895<![CDATA[Multipole-Based Cable Braid Electromagnetic Penetration Model: Electric Penetration Case]]>Progress in Electromagnetics Research B 66, 63–89 (2016). We first analyze the case of a 1-D array of wires: this is a problem which is interesting on its own, and we report its modeling based on a multipole-conformal mapping expansion and extension by means of Laplace solutions in bipolar coordinates. We then compare the elastance (inverse of capacitance) results from our first principles cable braid electromagnetic penetration model to that obtained using the multipole-conformal mapping bipolar solution. These results are found in a good agreement up to a radius to half spacing ratio of 0.6, demonstrating a robustness needed for many commercial cables. We then analyze realistic cable implementations without dielectrics and compare the results from our first principles braid electromagnetic penetration model to the semiempirical results reported by Kley in the IEEE Transactions on Electromagnetic Compatibility 35, 1–9 (1993). Although we find results on the same order of magnitude of Kley's results, the full dependence on the actual cable geometry is accounted for only in our proposed multipole model which, in addition, enables us to treat perturbations from those commercial cables measured.]]>6024444521287<![CDATA[Return Path Discontinuity Analysis of an Edge Mount SMA Launch Structure in Multilayer Boards]]>6024534581484<![CDATA[A Comprehensive and Modular Stochastic Modeling Framework for the Variability-Aware Assessment of Signal Integrity in High-Speed Links]]>602459467889<![CDATA[Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve]]>6024684771338<![CDATA[On the Robustness of CMOS-Chopped Operational Amplifiers to Conducted Electromagnetic Interferences]]>6024784862618<![CDATA[An Efficient Crosstalk Model For Coupled Multiwalled Carbon Nanotube Interconnects]]>6024874961230<![CDATA[Output-Capacitor-Free LDO Design Methodologies for High EMI Immunity]]>$mu$m CMOS process. When sine and pulse signals are applied to the input, the worst dc offset variations were enhanced from 36% to 16% and from 31.7% to 9.7%, respectively, as compared with those of the conventional LDO. We evaluated the noise performance versus the conducted electromagnetic interference generated by the dc–dc converter; the noise reduction level was significantly improved.]]>6024975061340<![CDATA[Multiple Objectives Optimization for an EBG Common Mode Filter by Using an Artificial Neural Network]]>602507512592<![CDATA[Passive Intermodulation of Contact Nonlinearity on Microwave Connectors]]>I–V relation is established from the microcontact equivalent circuit, and the third-order PIM power level generated by contact nonlinearity is revealed in analytic form. The analytic results are verified by the PIM test experiments. This work provides a novel way for PIM calculation of rough surface contact.]]>602513519823<![CDATA[Electromagnetic Compatibility Prediction Method Under the Multifrequency in-Band Interference Environment]]>602520528661<![CDATA[Optimization of the in situ Performance of Common Mode Chokes for Power Drive Systems Using Designable Parameters]]>in situ. All in situ impedances of the common mode current loop have been taken into account. Two test setups are used to validate effects related to changes of core material, size, number of turns, and wiring system.]]>602529535944<![CDATA[A Design Method for Synthesizing Miniaturized FSS Using Lumped Reactive Components]]>602536539547<![CDATA[Experimental Validation of an Analytical Model for the Design of Source-Stirred Chambers]]>6025405431243<![CDATA[Efficient Modeling of Multistage Integrated Circuit Passive Isolation Structures]]>602544547754<![CDATA[Coupling of Impulsive EM Plane-Wave Fields to Narrow Conductive Strips: An Analysis Based on the Concept of External Impedance]]>602548551389<![CDATA[$mathcal {H}$-Matrix Accelerated Contour Integral Method for Modeling Multiconductor Transmission Lines]]>$mathcal {H}$-matrix) algorithm for the extraction of the per-unit-length resistance and inductance parameters of massively coupled transmission lines. The procedures for the $mathcal {H}$-matrix-based solution are optimized to keep its optimal computational complexity. The numerical results from the proposed method agree well with those from the commercial software. The complexities of CPU time and memory cost for the construction of the $mathcal {H}$-matrices are both $O(Nlog {}N)$, and the complexity of the solution for parameter extraction is $O(Nlog ^2{}N)$.]]>602552555512<![CDATA[Attention Authors]]>602556557137<![CDATA[Introducing IEEE Collabratec]]>6025585581912<![CDATA[Together, we are advancing technology]]>602559559375<![CDATA[IEEE Access]]>602560560887<![CDATA[EMC Society Policy]]>602C3C354<![CDATA[IEEE Transactions on Electromagnetic Compatibility institutional listings]]>602C4C4157