Wide bandgap packaging for next generation power conversion systems

APEI, Inc. manufactures high performance, high temperature wide bandgap discrete packages, multi-chip power modules (MCPMs), and integrated systems for extreme environment applications. In this paper, APEI, Inc. presents two MCPMs, the HT-2000 and X-5, and two discrete packages, the X-6, and XHV-2, which were designed using advanced packaging materials and processes enabling high temperature operation coupled with high performance operation due to the superior characteristics of wide bandgap power switches. The key features of each of these packages will be discussed in this report.