Tombstone reduction by reflow profile optimization, SMT stencil design and pad design

With the technology advancing, most products are getting more personalize with various variety. Hand held products that are larger than palm size has no longer favor one's interest; the miniature product is the future, its means smaller, lighter and portable. Miniaturization product can be succeeded by reducing package size and the integration of ultra-small component (0402, 0201, 01005). SIP-MCM (system in package-multichip module) is one of the technologies that involve; this package is built with the combination of multiple dies and miniature passive components in SMT processes. In SMT process, small chip components prone to have tombstone defect