Growth pattern and morphology of micro nickel column by localized electrochemical deposition

Techniques of semiconductor manufacturing are still a matter of research, and localized electrochemical deposition is an efficient and economical micro-manufacturing technology. During LECD experiment, put a micro-anode close to a conducting substrate in plating bath and metal deposition will occur. In this paper metal deposition under different circumstances is explored. Good quality micro-column can be get in the case of low bias and small gap, but the deposition rate is very slow. Increasing bias and keeping the gap, deposition rate can be improved in the condition of a bad surface quality. And if gap is increased, the quality of columns can be improved at high bias. A nickel micro-column can be get in reasonable speed in high bias if gap can be fixed in a certain range. By comparing the growth of micro nickel column and electric field distribution among this three case, two main growth patterns are established to help us to understand the growth process and morphologies under different conditions.