Silver flakes filled interpenetrating polymer network: High performance electrically conductive adhesives for electronic packaging

Interpenetrating Polymer Network (IPNs) formed from a model triallyl isocyanurate (TAIC) and dicyandiamide-cured epoxy resin (Epon 828) has been introduced into conductive adhesive formula. The curing behavior and the compatibility of the networks were investigated by differential scanning calorimeter (DSC). The test result indicated that IPN have good compatibility. In addition, compared with a system composed of bare dicyandiamide-curing (Epon 828), the viscosity of adhesive based on the IPNs was decreased sharply as much as by 69%, and glass transition temperature (Tg) remains at a higher level. Compared with the ICAs based on dicyandiamide-curing (Epon 828) which has a resistivity of 3.12×10
^-3
Ω·cm and a shear strength of 13.6 MPa, ICAs based on IPN with a weight ratio of TAIC/Epon 828 = 2/10 shows a much lower volume resistivity of 1.02×10
^-3
Ω·cm and a much higher shear strength of 17.03 MPa, which was considered to be an ideal ICA candidate for electronic packaging applications.