System I/O optimization with SoC, SiP, PCB co-design

The unique requirements of entry into new markets (automotive, wearable, IoT) is forcing companies to implement sophisticated package structures to realize the latest product platforms that meet aggressive schedule and market requirements. To address these market challenges, engineering teams need to evolve from working in silos and working within a disconnected process, to a new or advanced methodologies and design flows that enable them to collaborate across disciplines and effectively meet these requirements. With a system-level co-design approach within a 3D hierarchal platform, engineers and architects are enabled to conduct path-finding studies and detail design for the chip, package, and PCB concurrently, and with access to analysis tools to ensure designs are completed to meet electrical and physical and manufacturing specification. System-level co-design offers engineering teams to reduce time-to-market and product cost by eliminating frequent hand-offs in the design process and optimize layer counts for RDL, interposer/substrates, packages, and PCBs.