The new high power density 7th generation IGBT module for compact power conversion systems

Major requirements for power conversion systems are “further downsizing” and “higher efficiency”. Enhanced power density of the power modules will be the key to succeed. Higher reliability in continuous high-temperature operation will be the major challenge. The performances of the modules were significantly improved by further improvement of the chip characteristics and the development of new high reliability package materials and technologies. Additionally, the maximum operating temperature was even increased to up to 175°C. The new 7
^th
generation IGBT module realized further downsizing and higher efficiency of power conversion systems.