3D electro-thermal simulation of multilayer power MOSFET structure under electro-thermal stress

In this work a 3D electro-thermal-mechanical simulation by a Finite Element Model (FEM) using COMSOL Multiphysics is used to investigate the robustness of a multilayer power MOSFET structure under electro-thermal stress. Thermal, stress and strain maps obtained by simulation help to identify the critical layers and to evaluate the reliability of the power component.