Research on 0.6 mil Ag-8Au-3Pd alloy wire bonding process

Ag-8Au-3Pd alloy wire has shown its advantages as a kind of interconnect material in semiconductor packaging. In thermosonic wire bonding, a uniformed and stable Free-Air-Ball (FAB) created by electronic flame-off (EFO) is crucial to a reliable 1st bond. In this study, the relationship between Free-Air-Ball (FAB) size and EFO parameters (EFO current, EFO time) of 0.6 mil Ag-8Au-3Pd alloy wire has been investigated. According to the FAB formation curve of 0.6 mil Ag-8Au-3Pd alloy wire, a suitable EFO parameter was settled down, then a design of experiment (DOE) was set up to investigate the optimum parameter window. As expected, the experiment results illustrate that 0.6 mil Ag-8Au-3Pd alloy wire is workable as the interconnect material with less cost.